Micro-assembly Capabilities
Based on Microwave hybrid integrated circuit process technology, the core process Engineers have nearly 20 years of microwave hybrid integrated circuit process accumulation.
Nearly 500㎡of 10k-class (ISO Class 7) standard purification workshop.
Mature process flow, stable process technology.
Automatic Packaging Process
Qotana has fully implemented the automatic packaging process. Multi-chip die bonder can achieve high precision, high efficiency and high consistency. Automatic die bonding system improves efficiency by more than 80%, positioning accuracy up to ±5um, first pass yield up to 99.99%, and 100% ensures the consistency of product performance.
Service Hotline
+86-28-64024007
Fax：+86-28-64024007
E-mail：Sales@wisewaves-tech.com
Address: 3/F~5/F, Unit 8, Build 1, No.4 Xinye Road, Hi-tech(West) Zone, Chengdu, Sichuan, P.R.China
SAF Coolest v1.3 设置面板 BGSSX-ZOHB-TESDE-AEE
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